首页> 外国专利> METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING VARIABLE LOAD CONCENTRATION PLANAR JUNCTIONS WITH VERY HIGH BREAKAGE VOLTAGE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING VARIABLE LOAD CONCENTRATION PLANAR JUNCTIONS WITH VERY HIGH BREAKAGE VOLTAGE

机译:具有非常高的击穿电压的具有可变负载集中平面结的半导体器件的制造方法

摘要

The invention relates to a method for the manufacture of high voltage semiconductor devices having at least one planar junction having a variable load concentration. The method consists of doping with an impregnated load. THE SAME TYPE, IN A MONOCRYSTALLINE SEMICONDUCTOR MATERIAL REGION, A FIRST AREA, THEN A SECOND AREA WHICH COMPRISES THE PREVIOUS AND THUS FOLLOWING, THEN TO CARRY OUT A THERMAL TREATMENT, IN ORDER TO MAKE A PLANAR JUNCTION HAVING A PROFILE IN GRADES AND A CONCENTRATION OF IMPURITY THAT DECREES FROM THE CENTER TO THE PERIPHERY ON A PREDETERMINED EXTEND. / P P IN THIS WAY, THE INTENSITY OF THE SURFACE ELECTRIC FIELD, WHEN THE JUNCTION IS POLARIZED IN REVERSE DIRECTION, IS REDUCED, WHAT MAKES IT POSSIBLE TO ACHIEVE PLANAR JUNCTIONS WITH VERY HIGH BREAKING VOLTAGES OF THE ORDER OF A FEW THOUSANDS OF VOLTS. / P
机译:用于制造高压半导体器件的方法技术领域本发明涉及一种用于制造具有至少一个具有可变的负载浓度的平面结的高压半导体器件的方法。该方法包括掺杂浸渍的负载。同一类型,在单晶半导体材料区域中,是第一个区域,然后是第二个区域,其中包括先前的区域,因此,继之以进行热处理,以使平面结点具有轮廓并在轮廓上轮廓化在预设范围内从中心到外围下降的杂质。

这样,当反方向对结进行极化时,表面电场的强度会减小,这可能会导致平面结具有很高的断裂阶数千伏。

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