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PATTERNING PROCESS USING LADDER-TYPE ORGANOSILOXANE RESIN AND PROCESS FOR PRODUCTION OF ELECTRONIC DEVICES UTILIZING SAID PATTERNING PROCESS
PATTERNING PROCESS USING LADDER-TYPE ORGANOSILOXANE RESIN AND PROCESS FOR PRODUCTION OF ELECTRONIC DEVICES UTILIZING SAID PATTERNING PROCESS
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机译:梯型有机硅氧烷树脂的制版工艺和利用上述制版工艺的电子设备生产工艺
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摘要
A patterning process is provided wherein a material to be etched is coated with a ladder type organosiloxane resin, the coated resin is irradiated with energy rays according to a desired pattern, the irradiated resin is subjected to a development treatment, and then, the material is etched by using the resin left after the development as a mask. The ladder type organosiloxane resin used is represented by the formula: ##STR1## wherein each R.sub.1 is independently selected from alkyl (Cl-6) groups, and phenyl and halophenyl groups, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 are independently selected from hydrogen, alkoxy (Cl- 3) groups, a hydroxyl group and alkyl (Cl-3) groups, and n is a number giving a Mw of about 1,000 to about 1,000,000. The patterning process can be advantageously employed for the production of electronic devices.
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