SILVER SOLDER ALLOY OF GOOD SURFACE CHARACTERISTIC OF SOLDER AFTER SOLDERING

摘要

PURPOSE:To improve the surface characteristics of solder after soldering by contg. specific ratios of Ag, Si, Cu, etc. CONSTITUTION:A titled alloy wherein 50-85wt% Ag, 0.05-6wt% Si and the balance Cu and unavoidable impurities or further 0.05-5wt% Sn and/or In are contained therein. This alloy has low vapor pressure, decreases roughening of surfaces after soldering, is free from resin-like intercrystalline shrinkage holes, and provides good surface characteristics to the soldered surfaces.