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Process for making a lead- or ribbonless solid electrolyte tantalum capacitor, apparatus adapted to this process and capacitor obtained

机译:制备无铅或无带固体电解质钽电容器的方法,适用于该方法的设备和获得的电容器

摘要

1. A process for manufacturing a tantalum capacitor having a solid electrolyte, of the kind without wire or outlet ribbon, comprising making a porous tantalum body (2) extended on one face (3) by a tantalum wire (6), forming a dielectric layer (7) covering the body and the wire, depositing a solid electrolyte layer (9) on the body and on a part of the wire, depositing a counter electrode layer (10) on a part of this solid electrolyte layer, coating the assembly with a sleeve (11) of electrically insulating material whilst leaving a portion of the counter electrode bare, and then depositing terminal conductive layers (12-13; 14-15; 32, 34; 36-33; 35, 37) insulated from one another and in contact with the wire (6) and the counter electrode (10) respectively, characterized in that, before the deposition of the terminal layers, the said sleeve (11) is formed by moulding in such a way that it masks the said portion of the counter electrode (10) so as to prevent it being coated.
机译:1.一种用于制造具有固体电解质的钽电容器的方法,该钽电容器不具有导线或出口带,其包括通过钽线(6)使多孔钽体(2)在一个面(3)上延伸,从而形成电介质。覆盖主体和导线的金属层(7),在主体和导线的一部分上沉积固体电解质层(9),在该固体电解质层的一部分上沉积对电极层(10),涂覆组件用电绝缘材料制成的套管(11),同时使对电极的一部分裸露,然后沉积与一个绝缘层绝缘的终端导电层(12-13; 14-15; 32,34; 36-33; 35,37)其特征在于,在沉积端子层之前,通过模制形成所述套管(11),以使其覆盖所述导线(6)和对电极(10),所述套管(11)覆盖所述导线(6)和对电极(10)。对电极(10)的一部分以防止其被涂覆。

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