首页> 外国专利> Embodiments of the wiring of a device has a circuit integrated a semi - conductor 12 of the type of the stacked

Embodiments of the wiring of a device has a circuit integrated a semi - conductor 12 of the type of the stacked

机译:装置的布线的实施例具有集成有堆叠类型的半导体12的电路。

摘要

The invention relates to a device has circuits integrated a semi - conductors. / p & & p & in this device comprising several blocks, it comprises a first, second and third regions semi conducting - (2a, b, c, 3a, b, c; 5a, b, c), two layers of wiring metal m, m, m; 11a, 11b, 11c are connected to the third semiconductor - conductive layer 5a, b, c of a manner that a direct polarisation is not wrapper at the terminals of the first and second semiconductor layers - conductors 2a, b, c, 3a, b, c. / p & & p & application in particular a of the circuits integrated the form of blocks of elements is a logic integrated injection stacked.
机译:本发明涉及一种具有集成有半导体的电路的装置。 & &在包括若干块的该装置中,它包括半导电的第一,第二和第三区域-(2a,b,c,3a,b,c; 5a,b,c),两层布线金属m,m,m;图11a,11b,11c连接到第三半导体-导电层5a,b,c,其方式是在第一和第二半导体层-导体2a,b,c,3a,b的端子上不包裹直接极化。 , C。 & &集成电路的应用尤其是集成的元件块形式是逻辑集成注入堆叠。

著录项

  • 公开/公告号FR2520555B1

    专利类型

  • 公开/公告日1987-02-20

    原文格式PDF

  • 申请/专利权人 HITACHI LTD;

    申请/专利号FR19820019859

  • 申请日1982-11-26

  • 分类号H01L27/08;H01L29/44;

  • 国家 FR

  • 入库时间 2022-08-22 07:11:34

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