NEEDLE PRESSURE ADJUSTING METHOD IN WAFER PROBER

摘要

PURPOSE:To contrive high accuracy by repeating the feedback of a result of judgment to a wafer prober by judging a contact check with a semiconductor tester. CONSTITUTION:A wafer 4 to be tested is set on a wafer prober 2 and a probe card 3 is provided with a needle 3a open on the wafer prober 2. Then, the probe card 3 on the wafer prober 2 is lowered, the needle 3a is slowly lowered; each time, a contact check is judged by a semiconductor tester 1. If the needle 3a is in the open state, a similar operation is repeated again, the needle 3a is brought into contact with the wafer 4 to be tested, all the needles 3a are made a short-circuit state and the test is repeated until a short-circuit is judged. Then, after short-circuit is judged as present, the needle pressure adjustment of the wafer prober 2 is finished by setting the needle 3a at the position further lowered by only an appropriate overdrive value Xmum from the position of the needle 3a on the wafer prober 2. This makes the automatic needle pressure adjustment between the needle tip of the probe card and the wafer to be tested, and an appropriate contact state can be obtained.