首页> 外国专利> Element e.g. conductor, resistance or di-electric prodn. on substrate - by shaping solvent free paste contg. filler and binder on substrate and hardening by microwave energy on support

Element e.g. conductor, resistance or di-electric prodn. on substrate - by shaping solvent free paste contg. filler and binder on substrate and hardening by microwave energy on support

机译:元素例如导体,电阻或介电产品在基材上-通过将无溶剂的糊剂整形而形成。填料和粘合剂在基材上,并通过微波能量在载体上硬化

摘要

Elements, e.g. conductors, resistances or dielectrics, are formed on a substrate by (a) forming the element on the substrate by means of a thick film paste contg. (i) 50-85 wt.% of a filler, and (ii) 50-15% of a binder, and free from solvent, (b) placing the substrate on a support, and (c) hardening the paste by converting microwave energy into conducted heat in the support.
机译:元素,例如通过(a)借助厚膜糊contg在基板上形成元件,在基板上形成导体,电阻或电介质。 (i)50-85 wt。%的填料,和(ii)50-15%的粘合剂,并且不含溶剂,(b)将基材放在载体上,以及(c)通过转换微波来硬化糊能量转化为支撑体中的传导热。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号