CATALYST SOLUTIONS FOR ACTIVATING NON-CONDUCTIVE SUBSTRATES AND ELECTROLESS PLATING PROCESS

摘要

improved activation composition for preparing a substrate for bonding in a plating bath without passage of electric current.an improved process is also described to activate substrates prior to metallization, as well as an improved method of metal using the activation process are improved.the deposit without passage of electric current to reduce the metal ions to chemically plating out from the bath and on a surface of a substrate is activated.is improved by using an organic acid in the bath, which activates the surface of the substrate.the use of active palladium halide ion containing the preferred to form a catalytic surface on the substrate, a stannous halide ions to form a floor protectoran ion source of a halide and an organic acid, such as citric acid or tartariques.the composition and method allow the elimination of a phase of acceleration are conventionally required.while providing good results especially with significantly higher substrates having through holes with a coating.such as a printed circuit plate, on which a copper plating is performed.