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Method and apparatus for inspecting plated through holes in printed circuit boards

机译:检查印刷电路板上镀通孔的方法和设备

摘要

@ To inspect plated through holes (4) in a printed circuit board (1), light (6) from a light source is shone on the board. Light enters the through holes and also the light-transmitting substrate (2) of the printed circuit board. A light detector (8) senses light from the holes and the signal from the light detector indicates the location of the holes.;A located hole (4) is masked to prevent light shining on the board from directly entering the hole. The only light which now enters the hole, leaks from the substrate through defects (3a) in the plating (3). A light detector (8) senses light from the hole, and the signal from the light detector indicates the presence of defects, if any, in the plating of the through hole.;Hence by signals supplied from light detectors, plated through holes can be continuously and efficiently inspected.
机译:@为了检查印刷电路板(1)中的镀通孔(4),将来自光源的光(6)照在板上。光进入印刷电路板的通孔以及透光衬底(2)。光检测器(8)感测来自孔的光,并且来自光检测器的信号指示孔的位置。遮盖已定位的孔(4),以防止照射在板上的光直接进入孔。现在唯一进入孔中的光通过镀层(3)中的缺陷(3a)从基板泄漏。光检测器(8)感测来自孔的光,并且光检测器发出的信号表明通孔镀层中存在缺陷(如果有的话);因此,从光检测器提供的信号来看,可以镀通孔持续有效地检查。

著录项

  • 公开/公告号EP0111404B1

    专利类型

  • 公开/公告日1988-07-27

    原文格式PDF

  • 申请/专利权人 FUJITSU LIMITED;

    申请/专利号EP19830307291

  • 申请日1983-11-30

  • 分类号G01N21/88;

  • 国家 EP

  • 入库时间 2022-08-22 06:56:00

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