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Metal core printed circuit board as substrat for high frequency and microwave circuits

机译:金属芯印刷电路板作为高频和微波电路的基板

摘要

The design for a printed circuit board is specified which is specifically suitable as a substrate for RF and microwave circuits. An even layer of homogeneous vitreous enamel (3) is applied to a metal core (1) consisting of a highly conductive material or coated with a highly conductive material (2). Copper conductor tracks (4) are deposited thereon non-electrically. Attenuation values and resonance qualities can be demonstrated for the RF and microwave circuits placed on such a substrate, which are at least equivalent to the values produced by circuits constructed on present-day conventional substrates (oxide ceramic, polytetrafluoroethylene). IMAGE
机译:指定了一种印刷电路板的设计,该设计特别适合用作RF和微波电路的基板。将均匀的玻璃质搪瓷均匀层(3)涂在由高导电材料组成或涂有高导电材料(2)的金属芯(1)上。铜导体迹线(4)非电沉积在其上。可以证明放置在这种基板上的RF和微波电路的衰减值和共振质量,这些衰减值和共振质量至少等于在当今常规基板(氧化物陶瓷,聚四氟乙烯)上构造的电路所产生的值。 <图像>

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