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Metal core printed circuit board as substrat for high frequency and microwave circuits

机译:金属芯印刷电路板作为高频和微波电路的基板

摘要

It is stated, the structure for a circuit board which are particularly suitable as carriers for RF and microwave circuits. On a group consisting of well-conducting material or with highly conductive material (2) coated metal core (1) is a uniform layer coated from a homogeneous vitreous enamel (3). Thereon strip conductors (4) are deposited of copper de-energized. Attenuation values ​​and grades can be resonance for the designed on such a substrate RF and microwave circuits demonstrate that provide values ​​to use today substrates (oxide ceramic, polytetrafluoroethylene) constructed circuits zumidest equal.
机译:据说,电路板的结构特别适合用作RF和微波电路的载体。在由导电性高的材料或导电性高的材料(2)组成的组中,涂覆有均质玻璃釉(3)的均一层覆盖了金属芯(1)。在其上沉积带电的铜带状导体(4)。衰减值和等级可以在这样的基板上进行设计谐振,RF和微波电路证明可以提供当今使用的基板(氧化物陶瓷,聚四氟乙烯)构造的电路,其值最相等。

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