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PROCESS FOR THE SIMULTANEOUS PRODUCTION OF RAPID SHORT-CHANNEL AND VOLTAGE-RESISTANT MOS TRANSISTORS IN VLSI CIRCUITS

机译:在VLSI电路中同时生产快速短沟道和耐压MOS晶体管的过程

摘要

A manufacturing method for VLSI MOS field effect transistor circuits having digital and analog functions performed by short channel transistors and analog transistors integrated on one chip. An n-tube manufacture is performed wherein as soft as possible a field progression in front of a drain-side pn-junction of the analog transistor is achieved. This occurs by means of an additional drain implantation (curve II) with drive-in diffusion before the actual source/drain implantation (curve I) of the n-channel transistors. Both the additional implantation as well as the source/drain implantation are carried out with phosphorous ions. The dosage of the additional implantation lies one to two orders of magnitude below the dosage of the actual implantation, and the penetration depth x in the additional drive-in diffusion is about twice as great as the penetration depth x of the actual source/drain regions. The method is applied in the manufacture of VLSI CMOS circuits.
机译:一种通过集成在一个芯片上的短通道晶体管和模拟晶体管执行的具有数字和模拟功能的VLSI MOS场效应晶体管电路的制造方法。进行n管制造,其中在模拟晶体管的漏极侧pn结前面实现尽可能软的场进展。这是通过在n沟道晶体管的实际源极/漏极注入(曲线I)之前进行带入扩散的附加漏极注入(曲线II)来实现的。额外的注入以及源/漏注入都用磷离子进行。附加注入的剂量比实际注入的剂量低一到两个数量级,并且附加驱入扩散中的穿透深度x约为实际源/漏区的穿透深度x的两倍。 。该方法被应用于VLSI CMOS电路的制造中。

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