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METHOD FOR DEPOSITING COMPOUND III-V OR II-VI SEMICONDUCTOR THIN FILMS TO A THERMALLY DECOMPOSED SUBSTRATE

机译:将化合物III-V或II-VI的薄膜沉积到热分解的基质中的方法

摘要

The invention relates to a process for the preparation of composite semiconductor thin films or to the introduction of an organometallic composition containing a Group III or II component and to a hydride containing a Group V or VI element on a heated substrate. , TO SUBMIT THERMAL DECOMPOSITION THEREFORE TO FORM, ON THE SUBSTRATE, A SEMICONDUCTOR COMPOUND III-V OR II-VI. / P P ACCORDING TO THE INVENTION, WHILE NORMALLY MAKING A FIRST CARRIER GAS AND A HYDRIDE DILUTED AT A FIRST CONCENTRATION WHICH IS NOT CHEMICALLY REACTED WITH THE ORGANOMETALLIC COMPOUND TO PRODUCE A III-V OR II-VI COMPOUND AND CONTAINS AN ELEMENT OF GROUP V OR VI, A CYCLE COMPRISING ONE METHOD OF INTRODUCTION, ON THE SUBSTRATE, HYDRIDE DILUTED BY A SECOND CARRIER GAS AND AT A CONCENTRATION SUPERIOR TO THE FIRST, A STEP OF INTERRUPTION OF THE INTRODUCTION OF THE HYDRIDE TO THE SECOND CONCENTRATION, A STEP OF INTRODUCTION TO THE SUBSTRATE OF AN ORGANOMETAL COMPOUND LIQUE DILATES WITH A THIRD CARRIER GAS AND CONTAINS A GROUP III OR II ELEMENT, A STEP FOR INTERRUPTING THE INTRODUCTION OF THE ORGANOMETALLIC COMPOUND AND A STEP IN INTRODUCING A GASEOUS HALIDE THAT IS DILUTED WITH A FOURTH CARRIER GAS. The invention applies in particular to semi-conductors.
机译:本发明涉及制备复合半导体薄膜的方法或涉及在加热的基材上引入包含III或II族组分的有机金属组合物以及包含V或VI族元素的氢化物的方法。 ,然后在基材上进行热分解,以形成半导体化合物III-V或II-VI。

根据本发明,在正常情况下使第一载气和稀释的第一浓度的氢化物不会与有机化合物发生化学反应而生成III-V或II-VI化合物并包含一种第V或VI组元素,在底物上包含一种引入方法的循环,由第二种载气稀释的氢化物,浓度高于第一个浓度,是将氢引入第二浓度的第一步,引入具有第三种载气且含有III或II族元素的有机化合物液状膨胀物的底物的步骤,引入有机化合物的步骤和引入被稀释的气态卤化物的步骤第四运气。本发明尤其适用于半导体。

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