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Mechanical and electrical assembling device for high-density electronic cards with thermal conduction cooling
Mechanical and electrical assembling device for high-density electronic cards with thermal conduction cooling
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机译:具有导热冷却的高密度电子卡的机电组装装置
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摘要
A U shaped electrical assembly device is provided which employs a zero insertion force receptacle on the two parallel arms of the U. The bottom side of the U shaped receptacle has a heat exchanger back piece which uses a slot to receive a thermal conductor employed on the insertable electronic cards which are to be placed within the receptacle.
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