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HGCDTE epitaxially grown on crystalline support

机译:HGCDTE外延生长在晶体载体上

摘要

A layer of HgCdTe (15) is epitaxially grown on a crystalline support (10). A single crystal CdTe substrate (5) is first epitaxially grown to a thickness of between 1 micron and 5 microns onto the support (10). Then a HgTe source (3) is spaced from the CdTe substrate (5) a distance of between 0.1 mm and 10 mm. The substrate (5) and source (3) are heated together in a thermally insulating, reusable ampoule (17) within a growth temperature range of between 500° C. and 625° C. for a growth time of between 5 minutes and 13 hours. In a first growth step embodiment, the source (3) and substrate (5) are non-isothermal. In a second growth step embodiment, the source (3) and substrate (5) are isothermal. Then an optional interdiffusion step is performed, in which the source (3) and substrate (5) are cooled within a temperature range of between 400° C. and 500° C. for a time of between 1 hour and 16 hours. Means are disclosed for preventing contamination of the reactants during HgTe (3) synthesis, and for polishing the finished HgCdTe layer (15).
机译:在晶体载体(10)上外延生长HgCdTe层(15)。首先将单晶CdTe基板(5)外延生长到1微米至5微米之间的厚度到支撑体(10)上。然后,将HgTe源(3)与CdTe衬底(5)间隔开0.1mm至10mm之间的距离。将基板(5)和源(3)在绝热的,可重复使用的安瓿(17)中在500℃至625℃之间的生长温度范围内一起加热5分钟至13小时之间的生长时间。在第一生长步骤实施例中,源(3)和衬底(5)是非等温的。在第二生长步骤实施例中,源(3)和衬底(5)是等温的。然后执行可选的互扩散步骤,其中将源(3)和衬底(5)在400℃至500℃的温度范围内冷却1小时至16小时的时间。公开了用于防止在HgTe(3)合成期间反应物的污染以及用于抛光完成的HgCdTe层(15)的装置。

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