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Substrate processing apparatus including wafer transporting and substrate cooling mechanisms
Substrate processing apparatus including wafer transporting and substrate cooling mechanisms
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机译:包括晶片传送和衬底冷却机构的衬底处理设备
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摘要
In a substrate processing apparatus, a substrate is processed to form a thin film thereon while it is maintained in the vertical direction, Furthermore, the rear surface of the substrate is cooled by a substrate cooling mechanism which contacts the rear surface thereof. The substrate cooling mechanism moves in a reciprocating fashion, whereas a substrate holder for holding the substrate moves both in horizontal and vertical directions.
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