A process for removing lead / tin, lead or tin layer from copper or nickel surfaces as well as bath solutions for use therein

摘要

An etch solution for removing lead/tin, lead or tin layers applied to copper or nickel surfaces consists of nitric acid and contains one or more inhibitor(s) such as block copolymers of propylene oxide and ethylene oxide or polyethylene glycols and/or polyols having a molecular weight greater than 2000.