apparatus for assembly of a contemporary cultural of components on printed circuit boards

• 1. 用于将机械零件组装在车辆本体上的设备 [P] . 中国专利： CN104284832B . 2016.10.12
• 2. 用于将机械零件组装在车辆本体上的设备 [P] . 中国专利： CN104284832A . 2015-01-14
• 3. Apparatus used for contemporary assembly of multiple components on printed circuit boards. [P] . IT1237037B . 1993-05-13

  机译： 用于在印刷电路板上现代组装多个组件的设备。

• 4. Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering [P] . 美国专利： US5607609A . 1997-03-04

  机译： 将电子元件焊接到印刷电路板上的方法和装置，以及通过焊接得到的电子元件和印刷电路板的组装

• 5. Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering [P] . 欧洲知识产权局专利： EP0649699A3 . 1995-07-12

  机译： 将电子元件焊接到印刷电路板上的方法和装置，以及通过焊接得到的电子元件和印刷电路板的组装

• 1. REENGINEERING THE ASSEMBLY PROCESSESOF PRINTED CIRCUIT BOARDS:A CASE STUDY [J] . 无 天津大学学报：英文版 . 2000,第002期
• 2. Heat Dissipation Performance of Metal Core Printed Circuit Board with Micro Heat Exchanger [J] . Diancheng Qin, Kewei Liang 哈尔滨工业大学学报（英文版） . 2020,第001期
• 3. The Disassembly Process and Apparatus of waste Printed Circuit Board Assembly for reusing the components [C] . Dong Xiang, Zufu Pang, Danfeng Long, International Conference on Frontiers of Mechanical Engineering and Materials Engineering . 2014
• 4. Integrated methodology for board assignment and component allocation in printed circuit board assembly. [D] . Neammanee, Patcharaporn. 2002
• 5. Character Recognition of Components Mounted on Printed Circuit Board Using Deep Learning [O] . Sumyung Gang, Ndayishimiye Fabrice, Daewon Chung, 2021
• 6. Integrated methodology for board assignment and component allocation in printed circuit board assembly [O] . 2001

• 1. Efficient recovery of valuable metals from waste printed circuit boards by microwave pyrolysis [J] . Yubo Liu ,Jialiang Zhang ,Xu Yang . 中国化学工程学报:英文版 . 2021,第12期
• 2. TDD-net: a tiny defect detection network for printed circuit boards [J] . Runwei Ding1 ,Linhui Dai1 ,Guangpeng Li2 . 智能技术学报 . 2019,第002期
• 3. An Improved Randomized Circle Detection Algorithm Using in Printed Circuit Board Locating Mark [J] . Jingkun Liu ,Qi Fan . 应用数学（英文） . 2019,第10期
• 4. 用于空气预热器和汽-汽加热设备的涂搪瓷钢板复合元件:从钢板成型、涂搪瓷到网格组装的综合方法 [C] . A.Chelli ,G.Minak ,V.Dal Re . 第21届国际搪瓷大会 . 2007
• 5. 纳米颗粒在脂质膜壳上的组装及应用于双模态成像的研究 [A] . 袁楚晓 . 2018