process for the manufacture of verrottbaren, preferably edible wafers

摘要

Wafer dough is baked between both baking surfaces of a wafer baking mould which can be opened and closed along a separation plane. The baking surfaces of the wafer baking mould which face one another define together with the sealing strips or steam sealing strips the three-dimensional shape of the baked wafer. In this process, firstly, liquid, low-fat wafer dough is poured into the open, hot wafer baking mould onto at least one of the two baking surfaces, and then the hot wafer baking mould is closed as far as the wall thickness of the wafer to be baked, whereupon the wafer dough is distributed in the closed wafer baking mould, filling it, and forms a wafer structural layer in the closed wafer baking mould. When the wafer structural layer has been formed and its surfaces facing the baking surfaces have been solidified in the closed wafer baking mould, but the wafer is as yet incompletely baked, the wafer is removed from the baking surfaces by opening the wafer baking mould once or several times during the continuing baking process, and is then baked to the finished wafer.