首页> 外国专利> AMORPHOUS SILICON THIN FILM TRANSISTOR ARRAY OF TOP STAGGER TYPE

AMORPHOUS SILICON THIN FILM TRANSISTOR ARRAY OF TOP STAGGER TYPE

机译:雄鹿型非晶硅薄膜晶体管阵列

摘要

PURPOSE:To improve the yield of the device by sharply reducing a broken source wiring upon etching by forming over the entirety of the upper portion of the source wiring an amorphous silicon layer more wider than the source wiring or an amorphous silicon layer and a silicon nitride layer disposed on the former. CONSTITUTION:A plurality of gate electrodes 1 are connected to each other through an Al gate wiring 4. A plurality of source electrodes 2 composed of ITOs are connected to each other through a source wiring 5. An amorphous silicon layer 6 and a silicon nitride layer 7 are formed on an FET section, and formed on the entire upper portion of the source wiring 5 wider than the source wiring 5. Hereby, the source wiring 5 is covered with another amorphous silicon layer 6 of the gate insulating layer 9 and with the silicon nitride 7. Accordingly, there is produced no pin hole and the like at the same portion in the above three layers. When the gate wiring 4 is etched and so on, the source wiring 5 is not damaged, and hence any trouble of broken source wiring 5 is greatly reduced.
机译:用途:通过在源极布线的整个上部上形成比源极布线更宽的非晶硅层或非晶硅层和氮化硅,在刻蚀时急剧减少断裂的源极布线,从而提高器件的成品率层置于前者上。组成:多个栅电极1通过Al栅极布线4相互连接。多个由ITO组成的源电极2通过源布线5相互连接。非晶硅层6和氮化硅层如图7所示,在FET部分上形成图7所示的半导体衬底,并且在比源极布线5宽的源极布线5的整个上部上形成源极布线5。由此,源极布线5被栅极绝缘层9的另一非晶硅层6以及栅极绝缘层9覆盖。因此,在上述三层中的相同部分没有产生针孔等。当蚀刻栅极配线4等时,源极配线5不会被损坏,因此大大减少了源极配线5折断的任何麻烦。

著录项

  • 公开/公告号JPH0216767A

    专利类型

  • 公开/公告日1990-01-19

    原文格式PDF

  • 申请/专利权人 SEIKOSHA CO LTD;

    申请/专利号JP19880167095

  • 申请日1988-07-05

  • 分类号G02F1/136;G02F1/1368;H01L21/336;H01L27/12;H01L29/78;H01L29/786;

  • 国家 JP

  • 入库时间 2022-08-22 06:26:37

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