WET CHEMICAL SURFA CE TREATMENT OF SEMICONDUCTOR WAFER

摘要

PURPOSE: To easily, quickly and effective execute a treating step by introducing a chemically active gaseous substance and atomized particle-like water in a system involving semiconductor wafers and by forming a phase acting on the surface contained in the system itself. CONSTITUTION: A chemically active gaseous substance and atomized particle-like water are fed in a system involving semiconductor wafers. The active substance is one which interacts with the atomized water to form a phase acting on the wafer surface and such a preferable gas example is ammonia, hydrogen chloride, hydrogen fluoride, ozone or ozonized oxygen. These gas and liq. phases interact to form a phase acting on the surface contained in the system itself. This wet chemically treats the polished surface of the semiconductor wafer, removes remaining dirty particles to accomplish a special surface nature by a simple and scientifically accurate method.