首页> 外国专利> BUILT-IN PRINT RESISTOR TYPE MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURE OF PRINT RESISTOR MOUNTING INNER LAYER SUBSTRATE TO BE USED FOR SAID PRINTED CIRCUIT BOARD

BUILT-IN PRINT RESISTOR TYPE MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURE OF PRINT RESISTOR MOUNTING INNER LAYER SUBSTRATE TO BE USED FOR SAID PRINTED CIRCUIT BOARD

机译:内置打印电阻器类型的多层打印电路板以及用于所述打印电路板的打印电阻器安装内层基板的制造

摘要

PURPOSE:To prevent the deterioration of characteristics at the time of built-in processing, by making the following a basic unit; an inner layer substrate on which a print resistor is mounted, a prepreg substrate which is bonded to a print resistor mounting surface of the inner layer substrate and unified in a body, and a single-side or both side printed circuit board which is bonded to the prepreg substrate surface and unified in a body. CONSTITUTION:On both surfaces of an insulating substrate 1 on which a print resistor is mounted, a single-side or double-side circuit board 2a is laminated by interposing an electrically insulative prepreg substrate 3a between them. Each of them is mutually bonded and unified in a body, to constitute a basic unit. On the circuit board 2a, single-side or double-side circuit boards 2b, 2c are laminated via prepreg substrates 3b, 3c, to constitute a multilayer printed circuit board, in which the following are formed according to the respective purposes; a through hole 4, a via hole 5 and a blind via hole 6. Thereby, the deterioration of characteristics at the time of built-in processing can be prevented.
机译:目的:为防止在内置处理时特性变差,请使以下基本单元为准;内层基板上安装有打印电阻器;预浸料基板,其粘结到内层基板的打印电阻器安装表面上,并一体形成于主体;单面或双面印刷电路板,其粘结到预浸料的基材表面统一在一个体内。组成:在绝缘基板1的两个表面上安装了打印电阻器,通过在它们之间插入电绝缘的预浸料基板3a来层压单面或双面电路板2a。它们中的每一个相互结合并统一在一个体内,构成一个基本单元。在电路板2a上,通过半固化片基板3b,3c层叠单面或双面电路板2b,2c,构成多层印刷电路板,根据各自的目的形成以下多层印刷电路板。贯通孔4,过孔5和盲孔6。由此,可以防止内置处理时的特性劣化。

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