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BUILT-IN PRINT RESISTOR TYPE MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURE OF PRINT RESISTOR MOUNTING INNER LAYER SUBSTRATE TO BE USED FOR SAID PRINTED CIRCUIT BOARD
BUILT-IN PRINT RESISTOR TYPE MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURE OF PRINT RESISTOR MOUNTING INNER LAYER SUBSTRATE TO BE USED FOR SAID PRINTED CIRCUIT BOARD
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机译:内置打印电阻器类型的多层打印电路板以及用于所述打印电路板的打印电阻器安装内层基板的制造
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摘要
PURPOSE:To prevent the deterioration of characteristics at the time of built-in processing, by making the following a basic unit; an inner layer substrate on which a print resistor is mounted, a prepreg substrate which is bonded to a print resistor mounting surface of the inner layer substrate and unified in a body, and a single-side or both side printed circuit board which is bonded to the prepreg substrate surface and unified in a body. CONSTITUTION:On both surfaces of an insulating substrate 1 on which a print resistor is mounted, a single-side or double-side circuit board 2a is laminated by interposing an electrically insulative prepreg substrate 3a between them. Each of them is mutually bonded and unified in a body, to constitute a basic unit. On the circuit board 2a, single-side or double-side circuit boards 2b, 2c are laminated via prepreg substrates 3b, 3c, to constitute a multilayer printed circuit board, in which the following are formed according to the respective purposes; a through hole 4, a via hole 5 and a blind via hole 6. Thereby, the deterioration of characteristics at the time of built-in processing can be prevented.
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