首页> 外国专利> ADDITIVE FOR USE IN THERMOSETTING EPOXY RESIN COMPOUND, ITS PREPARATION, CURING AGENT FOR EPOXY RESIN COMPOUND, AND CURE ACCELERATOR FOR EPOXY RESIN

ADDITIVE FOR USE IN THERMOSETTING EPOXY RESIN COMPOUND, ITS PREPARATION, CURING AGENT FOR EPOXY RESIN COMPOUND, AND CURE ACCELERATOR FOR EPOXY RESIN

机译:用于热固性环氧树脂复合材料的添加剂,其制备,环氧树脂复合材料的固化剂和环氧树脂的固化促进剂

摘要

An additive for thermocurable epoxy resin compositions contains or comprises adducts and/or reaction products of… (a) imidazoles of the formula I… …IMAGE… where R1, R2, R3 and R4 are H, alkyl having 1 to 3 carbon atoms or phenyl, and… (b) at least one aromatic hydroxy acid, such as a phenol- or naphtholsulphonic acid. It is suitable for use as the sole curing agent or as an accelerator in combination with other latent curing agents.
机译:用于可热固化的环氧树脂组合物的添加剂包含或包含以下化合物的加合物和/或反应产物:(a)式I…的咪唑………IMAGE>…其中R1,R2,R3和R4为H,碳原子数为1至3的烷基(b)至少一种芳族羟基酸,例如苯酚或萘磺酸。它适合用作单独的固化剂或与其他潜在的固化剂结合使用的促进剂。

著录项

  • 公开/公告号JPH0284426A

    专利类型

  • 公开/公告日1990-03-26

    原文格式PDF

  • 申请/专利权人 SKW TROSTBERG AG;

    申请/专利号JP19890164104

  • 发明设计人 BENEDEIKUTO HAMAA;BERUNTO GURAMURU;

    申请日1989-06-28

  • 分类号C08G59/40;C08G59/50;C08G59/68;

  • 国家 JP

  • 入库时间 2022-08-22 06:21:29

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