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PROCESS FOR FILLING A TROUGH-SHAPED DEPRESSION EXACTLY

机译:完全填充大幅度下降的过程

摘要

In the process, a layer of a preliminary product (22) of the layer to be formed is deposited on the substrate (3) provided with the depression (12), forming a cavity (25) corresponding to the depression (12) in the substrate. The cavity (25) of the preliminary product (22) is then almost filled with an auxiliary layer (26), leaving narrow, groove-like trenches (29). This structure is then provided with a levelling layer (30) thick enough to fill the trenches (29). Finally, the levelling layer (30) and the auxiliary layer (26) are completely removed by etching, and the part of the preliminary product (22) projecting above the depression (12) in the substrate is removed by etching to the level of the upper edge of the depression (12) in the substrate.
机译:在该过程中,将要形成的层的初级产品(22)的层沉积在设置有凹部(12)的基板(3)上,从而形成与凹部(12)相对应的空腔(25)。基质。然后,初级产品(22)的腔体(25)几乎被辅助层(26)填充,留下狭窄的槽状沟槽(29)。然后,该结构设有厚度足以填充沟槽(29)的找平层(30)。最后,通过蚀刻将流平层(30)和辅助层(26)完全除去,并且通过蚀刻至基板的凹部(12)的水平,除去初级产品(22)在基板的凹部(12)上方突出的部分。基板上凹陷(12)的上边缘。

著录项

  • 公开/公告号WO9007177A1

    专利类型

  • 公开/公告日1990-06-28

    原文格式PDF

  • 申请/专利权人 SIEMENS AKTIENGESELLSCHAFT;STEPHANI DIETRICH;

    申请/专利号WO1989EP01277

  • 发明设计人 STEPHANI DIETRICH;

    申请日1989-10-26

  • 分类号G11B5/127;G11B5/31;H01L21/20;

  • 国家 WO

  • 入库时间 2022-08-22 06:15:07

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