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Semiconductor component with electrode(s) on substrate surface - has four-layer electrode assembly with top and bottom electrodes sandwiching amorphous silicon and silicon insulating film
Semiconductor component with electrode(s) on substrate surface - has four-layer electrode assembly with top and bottom electrodes sandwiching amorphous silicon and silicon insulating film
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机译:半导体元件在基板表面上具有电极-具有四层电极组件,其上下电极夹着非晶硅和硅绝缘膜
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摘要
The semiconductor substrate (101) carries two electrodes (102, 106) to which voltage is applied and forms a transition from a high resistance to a low one between both electrodes. The electrode assembly contains a region of amorphous silicon (105). The electrode assembly is a four-layer lamination with a top electrode (106), the amorphous silicon region, a silicon insulating film (107), and a lower electrode. The lower electrode pref. consists of a dopant diffusion zone on the semiconductor substrate surface. Alternately, it is formed by a polycrystalline silicon. The amorphous silicon typically contains a dopant of the group III. USE/ADVANTAGE - For data memories, with resistance value equaling that of insulating material.
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