MULTIPLE FOIL TRANSIENT LIQUID PHASE BONDING

• 1. 接合半导体器件和散热安装座的银铟瞬态液相方法及有银铟瞬态液相接合接头的半导体结构 [P] . 中国专利： CN112204731A . 2021-01-08
• 2. 一种瞬态电流键合抑制复合钎料中增强相团聚与上浮的方法 [P] . 中国专利： CN113649665A . 2021-11-16
• 3. MULTIPLE FOIL TRANSIENT LIQUID PHASE BONDING [P] . 英国专利： GB2197235A . 1988-05-18

  机译： 多箔瞬态液相键合

• 4. Multiple foil transient liquid phase bonding [P] . 美国专利： US4700881A . 1987-10-20

  机译： 多箔瞬态液相键合

• 5. SILVER-INDIUM TRANSIENT LIQUID PHASE METHOD OF BONDING SEMICONDUCTOR DEVICE AND HEAT-SPREADING MOUNT AND SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE BONDING JOINT [P] . US2022005744A1 . 2022-01-06

  机译： 粘合半导体器件的银铟瞬态液相方法和具有银铟瞬态液相粘接接头的散热架和半导体结构

• 1. Interface evolution of TiAl/Ti6242 transient liquid phase joint using Ti, Cu foils as insert metals [J] . DUAN Hui-ping, K. H. Bohm, V. Ventzke, 中国有色金属学报（英文版） . 2005,第002期
• 2. Microstructural developments and precipitate transformation during transient liquid-phase bonding of a duplex stainless steel [J] . YUAN Xin-jian, KANG Chung-Yun 中南大学学报（英文版） . 2013,第001期
• 3. Process Optimization of Foil-Based Transient Liquid Phase Bonding for Die Attachment [C] . Markus Feißt, Jan Kustermann, Axel Schumacher, 2019 42nd International Spring Seminar on Electronics Technology . 2019
• 4. Metallurgical Studies of Transient Liquid Phase Bonding of 7075 Aluminum Alloy with Zinc Filler Metal [D] . Lin, Shujun. 2018
• 5. Transient Liquid Phase Bonding of Ti-6Al-4V and Mg-AZ31 Alloys Using Zn Coatings [O] . Abdulaziz AlHazaa, Ibrahim Alhoweml, Muhammad Ali Shar, 2019
• 6. Active-Transient Liquid Phase (A-TLP) Bonding of Pure Aluminum Matrix Composite Reinforced with Short Alumina Fiber Using Al-12Si-xTi Foils as Active Interlayer [O] . Guifeng Zhang, Wei Su, Akio Suzumura 2016

• 1. A two-step transient liquid phase diffusion bonding process of T91 steels [J] . Chen Sijie ,Tang Hengjuan ,Zhao Pifeng . 中国焊接 . 2017,第002期
• 2. Research on Interlayer Alloys for Transient Liquid Phase Diffusion Bonding of Single Crystal Nickel Base Superalloy DD6 [J] . Qiuya Zhai ,Jinfeng Xu ,Tianyu Lu . 材料科学与化学工程（英文） . 2014,第9期
• 3. Microstructural developments and precipitate transformation during transient liquid-phase bonding of a duplex stainless steel [J] . 袁新建 ,KANG Chung-Yun . 中南大学学报 . 2013,第001期
• 4. 高效液相键合色谱填料分离不对称合成手性催化剂配体 [C] . . 第十届全国青年分析测试学术报告会 . 2008
• 5. Cu/In体系低温瞬态液相键合工艺及其机理的研究 [A] . 石小龙 . 2019