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Process for photo-assisted epitaxial growth using remote plasma with in- situ etching

机译:使用远程等离子体和原位蚀刻进行光辅助外延生长的工艺

摘要

A process for forming deposited film, which comprises:P P(a) the step of preparing a substrate having crystal nuclei or regions where crystal nuclei are selectively formed scatteringly on the surface for forming deposited film in a film forming space for formation of deposited film;PP(b) the step of forming deposited film on the above substrate by introducing an activated species (A) formed by decomposition of a compound (SX) containing silicon and a halogen and an activated species (B) formed from a chemical substance for film formation (B) which is chemically mutually reactive on said activated species (A) separately from each other into said film-forming space to effect chemical reaction therebetween;PP(c) the step of introducing a gaseous substance (E) having etching action on the deposited film to be formed or a gaseous substance (E.sub.2) forming said gaseous substance (E) into said film-forming space during said film- forming step (b) and exposing the deposited film growth surface to said gaseous substance (E) to apply etching action thereon, thereby effecting preferentially crystal growth in a specific face direction;P P(d) irradiating said gaseous substance (E) with light energy during said step (c), andPP(e) the step of increasing etching activity of said gaseous substance (E) by irradiation of light energy.
机译:沉积膜的形成方法,包括:(P)<P>(a)制备在形成膜的空间中用于形成沉积膜的表面上具有晶体核或选择性地分散形成晶体核的区域的基板的步骤。 (P)& P&(b)通过引入由含硅和卤素的化合物(SX)分解形成的活化物质(A)和活化物质在上述基板上形成沉积膜的步骤(B)由用于成膜的化学物质(B)形成,所述化学物质在所述活化物质(A)上彼此化学反应,彼此独立地进入所述成膜空间,以在它们之间进行化学反应; )在所述成膜过程中将对形成的沉积膜具有蚀刻作用的气态物质(E)或形成所述气态物质(E)的气态物质(E.sub.2)引入所述成膜空间的步骤步骤(b)和曝光沉积膜气态物质(E)的生长表面在其上施加蚀刻作用,从而优先在特定面方向上进行晶体生长;(P)

(d)在所述步骤(c)中用光能照射所述气态物质(E) )和(P)(e)通过光能的照射来提高所述气态物质(E)的蚀刻活性的步骤。

著录项

  • 公开/公告号US4918028A

    专利类型

  • 公开/公告日1990-04-17

    原文格式PDF

  • 申请/专利权人 CANON KABUSHIKI KAISHA;

    申请/专利号US19880262233

  • 发明设计人 SHIGERU SHIRAI;

    申请日1988-10-21

  • 分类号H01L21/20;H01L21/306;

  • 国家 US

  • 入库时间 2022-08-22 06:07:39

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