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COMPOSITE MATERIAL VARIABLE IN COEFFICIENT OF THERMAL EXPANSION AND HEAT CONDUCTIVITY
COMPOSITE MATERIAL VARIABLE IN COEFFICIENT OF THERMAL EXPANSION AND HEAT CONDUCTIVITY
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机译:热膨胀系数和导热系数的复合材料变量
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摘要
PURPOSE:To obtain a composite material whose coefficient of thermal expansion and heat conductivity can be aribitrarily selected corresponding to a use or purpose by integrating a high thermal expansion metal plate with a low thermal expansion metal plate having a large number of piercing holes in its thickness direction and selecting the thickness ratio of both metal plates and the surface area ratio of the exposed high and low thermal expansion metals. CONSTITUTION:A low thermal expansion metal plate having a large number of piercing holes 13 in its thickness direction, for example, a Kovar plate 12 is integrated with a high thermal expansion metal plate, for example, a copper plate 11 in a pressure contact state and the high thermal expansion metal is exposed to the surface of the low thermal expansion metal plate from the piercing holes 13 and, by appropriately selecting the thickness ratio of both metal plates or the exposed area ratio of these metal plates on a main surface, the coefficient of thermal expansion and heat conductivity can be arbitrarily changed. By rolling the high thermal expansion metal plate 11 and the low thermal expansion metal plate 12 having a large number of the piercing holes 13 in its thickness direction in a pressure contact state, an objective composite material 10 is prepared.
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