MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD WITH RIGID AND SOFT REGIONS OR OF PRINTED CIRCUIT BOARD BURIED LAYER

摘要

PURPOSE: To protect a conductor path surely against cracking at the time of laminating a cover film by punching a flat member having dimensions identical to those of a soft region to be formed before an individual layer composite body is laminated therein and then inserting the composite body again tightly into a punched window thereby eliminating the need of making a groove or a slit and sealing the soft region hermetically. CONSTITUTION: A window having dimensions corresponding to those of a soft region is punched through a rigid insulating material layer before a composite body is laminated thereon. In this regard, it is not a problem whether the layer is copper clad already. Immediately after punching, the punched piece is pushed back tightly into the remaining window. After the soft part is sealed hermetically and a conductor pattern is formed on a panel by a general method, a rigid filler can be stripped off easily from the soft part. For example, a line 21 implies the outline of the rigid region and a line 8 implies the outline of the soft region. A hole 24 is useful for recording a conductor pattern 11 in a recess 22. A piece 23 of the rigid insulating material layer 3 is fitted tightly in the recess 22. The soft insulating material layer 1, i.e., a polyamide film, and the rigid insulating material layer 3 are pasted each other through a composite film 2.