COVERLAY FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF FORMING COVERLAY OF FLEXIBLE PRINTED CIRCUIT BOARD USING SAME

• 1. 多层柔性印刷电路板的粘合层形成用的树脂组合物、树脂清漆、带树脂铜箔,多层柔性印刷电路板制造用的带树脂铜箔的制造方法以及多层柔性印刷电路板 [P] . 中国专利： CN102640576B . 2014.10.29
• 2. 多层柔性印刷电路板的粘合层形成用的树脂组合物、树脂清漆、带树脂铜箔,多层柔性印刷电路板制造用的带树脂铜箔的制造方法以及多层柔性印刷电路板 [P] . 中国专利： CN102640576A . 2012-08-15
• 3. COVERLAY FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF FORMING COVERLAY OF FLEXIBLE PRINTED CIRCUIT BOARD USING SAME [P] . 日本专利： JPS60213087A . 1985-10-25

  机译： 柔性印刷电路板的覆膜和使用该覆膜形成柔性印刷电路板的覆膜的方法

• 4. ADHESIVE COMPOSITION, AND FLEXIBLE PRINTED CIRCUIT BOARD, COPPER CLAD LAMINATE FOR FLEXIBLE PRINTED WIRING BOARD AND COVERLAY FILM FOR FLEXIBLE PRINTED WIRING BOARD USING THE SAME [P] . 日本专利： JP2006225502A . 2006-08-31

  机译： 胶粘剂和挠性印刷电路板，挠性印刷线路板的覆铜箔层压板和挠性印刷线路板的覆膜使用相同的涂层

• 5. FLAME-RETARDANT RESIN COMPOSITION, METAL-CLAD LAMINATED BOARD FOR FLEXIBLE PRINTED CIRCUIT BOARD, COVERLAY FILM AND FLEXIBLE PRINTED CIRCUIT BOARD [P] . 日本专利： JP2003165898A . 2003-06-10

  机译： 阻燃树脂组合物，用于柔性印刷电路板的金属包覆层压板，覆膜和柔性印刷电路板

• 1. Highly Conductive Fractal-structured Silver Particles for Preparing Flexible Printed Circuits via Screen Printing [J] . Sufeng Zhang, Chen Hua, Bin He, 造纸与生物质材料：英文版 . 2021,第002期
• 2. Laser-Assisted Reduction of Highly Conductive Circuits Based on Copper Nitrate for Flexible Printed Sensors [J] . Shi Bai, Shigang Zhang, Weiping Zhou, 纳微快报：英文版 . 2017,第004期
• 3. Flexible Coverlay of High Density Flexible Circuits - Material Selections of Photo Imageable Coverlay [C] . Art Kabe, Dominique Numakura IPC printed circuits expo . 2003
• 4. Creating and balancing process flexibility between uncertainty and opportunity: An empirical investigation of the printed circuit board manufacturing industry. [D] . Sawhney, Rajeev. 2000
• 5. Feasibility Test of a Liquid Film Thickness Sensor on a Flexible Printed Circuit Board Using a Three-Electrode Conductance Method [O] . Kyu Byung Lee, Jong Rok Kim, Goon Cherl Park, 2017
• 6. Feasibility Test of a Liquid Film Thickness Sensor on a Flexible Printed Circuit Board Using a Three-Electrode Conductance Method [O] . Kyu Byung Lee, Jong Rok Kim, Goon Cherl Park, 2016
• 7. Flexible Composite Film for Printed Circuit Board [R] . Yabe, K., Asakura, M., Tanaka, H., 1982

• 1. 10 Gb/s Optical Interconnection on Flexible Optical Waveguide in Electronic Printed Circuit Board [J] . Shih-Hsiang Hsu ,Chih-Yuan Tsou ,Chih-Ming Wang . 光学与光子学期刊（英文） . 2013,第2期
• 2. Highly Conductive Fractal-structured Silver Particles for Preparing Flexible Printed Circuits via Screen Printing [J] . Sufeng Zhang ,Chen Hua ,Bin He . 国际造纸 . 2021,第002期
• 3. Laser-Assisted Reduction of Highly Conductive Circuits Based on Copper Nitrate for Flexible Printed Sensors [J] . Shi Bai ,Shigang Zhang ,Weiping Zhou . 安徽地质 . 2017,第004期
• 4. 具有局部耐久结构覆膜支架织物覆膜的成型与性能研究 [C] . 林婧 ,杜佳 ,王韶霞 . 2017中国生物材料大会 . 2017
• 5. 柔性环氧树脂基覆膜制备技术及性能研究 [A] . 倪莉娟 . 2018