ADHESIVE COMPOSITION, AND FLEXIBLE PRINTED CIRCUIT BOARD, COPPER CLAD LAMINATE FOR FLEXIBLE PRINTED WIRING BOARD AND COVERLAY FILM FOR FLEXIBLE PRINTED WIRING BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in adhesiveness and heat resistance, and a flexible printed circuit board, a copper clad laminate for a flexible printed wiring board and a coverlay film for the flexible printed wiring board using the same.;SOLUTION: The adhesive composition comprises a base resin (D) containing an epoxy resin (A), a curing agent (B) and a rubber component (C), and nanoparticles (E) having a particle size of 0.1 m or less. The nanoparticles (E) are contained in an amount of 1-5 wt% based on the sum of the base resin (D) and the nanoparticles (E). The nanoparticles (E) is characterized by having a particle size of 0.1 m or less.;COPYRIGHT: (C)2006,JPO&NCIPI