首页> 外国专利> MIXED TECHNOLOGY INTEGRATED DEVICE WHICH IS MADE UP BY COMPRISING COMPLEMENTARY LD MOS POWER TRANSISTOR, CMOS AND VERTICAL PNP INTEGRATED STRUCTURE HAVING SUPERIOR CAPACITY TO STAND RELATIVELY HIGH SUPPLY VOLTAGE

MIXED TECHNOLOGY INTEGRATED DEVICE WHICH IS MADE UP BY COMPRISING COMPLEMENTARY LD MOS POWER TRANSISTOR, CMOS AND VERTICAL PNP INTEGRATED STRUCTURE HAVING SUPERIOR CAPACITY TO STAND RELATIVELY HIGH SUPPLY VOLTAGE

机译:由互补的LD MOS功率晶体管,CMOS和垂直PNP集成结构组成的混合技术集成设备,具有超强的容量,可以保持较高的电源电压

摘要

PURPOSE: To withstand a high working voltage by providing a P-doped n-type Si region having a diffusion profile expanding from the surface of an n-type epitaxial layer. CONSTITUTION: Phosphorus-doped n-type region 8 are disposed in the drain area of an n-channel LDMOS transistor expanding between a gate electrode 12 and separation field oxide 5, in the source area of a p-channel LDMOS transistor expanding between the gate electrode 12 and separation field oxide 5 and in the drain area of an n-channel MOS transistor expanding between the gate electrode 12 and separation field oxide 5. At least n+ drain diffused parts 10, p+ source junctions 9, n+ body contact regions 10, and n+ emitter junctions 10 are included and expanded by their depths from the surface of an epitaxial layer 2 in the emitter area of pnp bipolar transistors with collectors limited by the peripheral separation field oxide 5.
机译:目的:通过提供一个具有从n型外延层表面扩展的扩散轮廓的P掺杂n型Si区域来承受高工作电压。组成:磷掺杂的n型区域8设置在在栅电极12和隔离场氧化物5之间扩展的n沟道LDMOS晶体管的漏极区域中,在在栅极之间扩展的p沟道LDMOS晶体管的源极区域中电极12和分离场氧化物5以及在栅电极12和分离场氧化物5之间扩展的n沟道MOS晶体管的漏极区域中。至少n +漏极扩散部分10,p +源极结9,包括n +体接触区域10和n +发射极结10,并且它们从pnp双极晶体管的发射极区域中的外延层2的表面起的深度扩大,其集电极受到外围分离场氧化物5的限制。 。

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