ANISOTROPIC CONDUCTIVE ADHESIVE, METHOD OF ELECTRICAL CONNECTION BETWEEN ELECTRODES USING SUCH ADHESIVE, AND ELECTRIC CIRCUIT BASE FORMED IN SUCH METHOD

摘要

PURPOSE:To increase the reliability even in the connection of fine pitch multicontact electrodes by using an isotropic conductive adhesive in which particles made by covering the surfaces of the conductive particles with an insulating thermal-plastic resin are dispersed, in the insulating adhesive component. CONSTITUTION:In an insulating adhesive component, an isotropic conductive adhesive in which particles made by covering the surfaces of conductive particles with an insulating thermal-plastic resin are dispersed is used to connect electrodes electrically. When a thermal- hardening type resin is used, a thermal-hardening type resin hardened at the temperature higher about 10 deg.C or more than the softening temperature of the insulating thermal-plastic resin covering the surface of the conductive particles is used. First a base 2 furnishing electrodes 1, and an IC chip 4 furnishing electrodes 3 are opposed, and after placing the isotropic conductive adhesive between the electrodes in a printing, spreading, or the like, a pressure is applied until the membranous particles 5 are about to scatter in a single layer. Then, by heating while maintaining the pressurized condition, the contact parts between the insulating thermal-plastic resin covering the surfaces of the conductive particles and the electrodes are molten partially, and the electrodes are connected electrically.