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Anisotropic conductive adhesive, method for electrically connecting electrodes using the anisotropic conductive adhesive, and electric circuit board formed by the method
Anisotropic conductive adhesive, method for electrically connecting electrodes using the anisotropic conductive adhesive, and electric circuit board formed by the method
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机译:各向异性导电粘合剂,使用该各向异性导电粘合剂电连接电极的方法以及通过该方法形成的电路板
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摘要
PURPOSE:To increase the reliability even in the connection of fine pitch multicontact electrodes by using an isotropic conductive adhesive in which particles made by covering the surfaces of the conductive particles with an insulating thermal-plastic resin are dispersed, in the insulating adhesive component. CONSTITUTION:In an insulating adhesive component, an isotropic conductive adhesive in which particles made by covering the surfaces of conductive particles with an insulating thermal-plastic resin are dispersed is used to connect electrodes electrically. When a thermal- hardening type resin is used, a thermal-hardening type resin hardened at the temperature higher about 10 deg.C or more than the softening temperature of the insulating thermal-plastic resin covering the surface of the conductive particles is used. First a base 2 furnishing electrodes 1, and an IC chip 4 furnishing electrodes 3 are opposed, and after placing the isotropic conductive adhesive between the electrodes in a printing, spreading, or the like, a pressure is applied until the membranous particles 5 are about to scatter in a single layer. Then, by heating while maintaining the pressurized condition, the contact parts between the insulating thermal-plastic resin covering the surfaces of the conductive particles and the electrodes are molten partially, and the electrodes are connected electrically.
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