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MOUNTING OF TAPE CARRIER TYPE IC PACKAGE AND TAPE CARRIER TYPE IC PACKAGE

机译:磁带载体型IC封装和磁带载体型IC封装的安装

摘要

PURPOSE:To securely connect each outer lead to a partner conductor part without causing any positional displacement between each outer lead and each conductor part of a substrate by performing connection with a state where mutual positional relationships among a plurality of the outer leads are fixed through coupling means. CONSTITUTION:A plurality of outer leads 5 disposed in the same direction are fixed in their mutual positional relationships through coupling means, so that the mutual positional relationships among the respective outer leads 5 are prevented from being changed in a mounting process of a package 1 onto a substrate 30 and further disorders of intervals and arrangements of the respective outer leads 5 are prevented from being produced. In such a state where disorders of intervals and arrangements among the respective outer leads 5 are prevented, a plurality of the outer leads 5 of the substrate 30 to conductor parts 31 are connected. Hereby, positional displacements between the respective outer leads 5 and the respective conductor parts of the substrate 30 caused by the disorders of the intervals and arrangements of the respective outer leads 5 are prevented and hence the respective outer leads 5 are securely connected to the corresponding conductor parts 31.
机译:目的:通过在通过耦合固定多个外部引线之间相互位置关系的状态下进行连接,将每个外部引线牢固地连接到配对导体部分,而不会在每个外部引线和基板的每个导体部分之间引起任何位置偏移。手段。组成:沿同一方向布置的多条外引线5通过耦合装置固定在它们相互之间的位置关系中,从而防止了在封装1安装到其上的过程中改变各外引线​​5之间的相互位置关系。防止了基板30的产生,并且防止了各个外部引线5的间隔和布置的进一步混乱。在防止各外部引线5之间的间隔和配置混乱的状态下,将基板30的多个外部引线5连接至导体部31。从而,防止了由于各个外部引线5的间隔和布置的不规则引起的各个外部引线5与基板30的各个导体部分之间的位置偏移,因此各个外部引线5被牢固地连接至对应的导体。第31部分。

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