ETCHING METHOD FOR POLYIMIDE RESIN FILM, WIRING STRUCTURE USING THE METHOD, AND PROCESSING METHOD FOR MATERIAL TO BE ETCHED

摘要

PURPOSE:To prevent deterioration in capacity and insulation property by the corrosion, etc., of a wiring conductor, caused by a denatured layer, so as to improve the reliability of an element by removing, with an organic solvent, the denatured layer which is created at the surface of a polyimide resin film, reacting with etching during etching. CONSTITUTION:In the method of forming a resist film pattern 3 at a polyimide resin film 2 formed on a substrate 1, and selectively etching the polyimide resin film in etchant with the resist film pattern 3 as a mask, the denatured film arising on the polyimide resin film by etchant is removed by an organic solvent. It is to be desired that this organic solvent should be selected from aprotic polar solvent and/or polyamide. To remove the organic solvent used in the surface treatment of the polyimide resin film, cleaning and/or heating is done. Hereby, partial weakening of the polyimide resin film, which is caused by the staying organic solvent, can be prevented.