首页> 外国专利> METHOD OF MANUFACTURING METAL THIN FILM ON POLYIMIDE RESIN SURFACE AND METAL THIN FILM FORMED BY SAME METHOD, AND MANUFACTURING METHOD OF POLYIMIDE WIRING BOARD AND POLYIMIDE WIRING BOARD MANUFACTURED BY SAME METHOD

METHOD OF MANUFACTURING METAL THIN FILM ON POLYIMIDE RESIN SURFACE AND METAL THIN FILM FORMED BY SAME METHOD, AND MANUFACTURING METHOD OF POLYIMIDE WIRING BOARD AND POLYIMIDE WIRING BOARD MANUFACTURED BY SAME METHOD

机译:在聚酰亚胺树脂表面上制造金属薄膜的方法和用相同方法制成的金属薄膜,以及用相同方法制造的聚酰亚胺布线板和聚酰亚胺布线板的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a metal thin film and a polyimide wiring board that have sufficient adhesive strength between them, and manufacturing methods thereof.;SOLUTION: Disclosed are: a method of manufacturing the metal thin film on a polyimide resin surface including a modification process of forming a modified layer by processing the polyimide resin surface with a first alkali solution to open an imide ring, a metal ion adsorption process of processing the modified layer with a metal ion containing solution, a first acid solution processing process of processing the modified layer with an acid solution; and a reduction process of processing the modified layer with a reducing solution to reduce metal ions adsorbed in the modified layer, and depositing a metal thin film; and the metal thin film formed by the same method. Further, disclosed are a manufacturing method of a polyimide wiring board including a wiring formation process of forming a wiring pattern after the manufacturing method of the metal thin film is implemented, and the polyimide wiring board manufactured by the same method.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种金属薄膜和聚酰亚胺布线板,它们之间具有足够的粘合强度;及其制造方法。解决方案:本发明公开了一种在包括以下材料的聚酰亚胺树脂表面上制造金属薄膜的方法:通过用第一碱溶液处理聚酰亚胺树脂表面以形成酰亚胺环而形成改性层的改性处理,用含金属离子的溶液处理改性层的金属离子吸附处理,处理第一酸溶液的处理处理的金属离子吸附处理。用酸溶液改性的层;还原工序是用还原溶液对改性层进行处理以还原吸附在改性层中的金属离子,并沉积金属薄膜的还原工序。与通过相同方法形成的金属薄膜。此外,公开了一种聚酰亚胺布线板的制造方法,该方法包括在实施金属薄膜的制造方法之后形成布线图案的布线形成工序,以及通过相同方法制造的聚酰亚胺布线板。 )2009,日本特许厅

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