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METHOD OF MANUFACTURING METAL THIN FILM ON POLYIMIDE RESIN SURFACE AND METAL THIN FILM FORMED BY SAME METHOD, AND MANUFACTURING METHOD OF POLYIMIDE WIRING BOARD AND POLYIMIDE WIRING BOARD MANUFACTURED BY SAME METHOD
METHOD OF MANUFACTURING METAL THIN FILM ON POLYIMIDE RESIN SURFACE AND METAL THIN FILM FORMED BY SAME METHOD, AND MANUFACTURING METHOD OF POLYIMIDE WIRING BOARD AND POLYIMIDE WIRING BOARD MANUFACTURED BY SAME METHOD
PROBLEM TO BE SOLVED: To provide a metal thin film and a polyimide wiring board that have sufficient adhesive strength between them, and manufacturing methods thereof.;SOLUTION: Disclosed are: a method of manufacturing the metal thin film on a polyimide resin surface including a modification process of forming a modified layer by processing the polyimide resin surface with a first alkali solution to open an imide ring, a metal ion adsorption process of processing the modified layer with a metal ion containing solution, a first acid solution processing process of processing the modified layer with an acid solution; and a reduction process of processing the modified layer with a reducing solution to reduce metal ions adsorbed in the modified layer, and depositing a metal thin film; and the metal thin film formed by the same method. Further, disclosed are a manufacturing method of a polyimide wiring board including a wiring formation process of forming a wiring pattern after the manufacturing method of the metal thin film is implemented, and the polyimide wiring board manufactured by the same method.;COPYRIGHT: (C)2009,JPO&INPIT
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