Si/SiGe heterojunction bipolar transistor utilizing advanced epitaxial deposition techniques and method of manufacture

摘要

A semiconductor device and the method of manufacturing that device that is a low capacitance, high speed, heterojunction semiconductor device. Such a device includes a Si substrate with a subcollector layer on top of the substrate, and a field oxide layer with a window therethrough to define the active region of the semiconductor device over a portion of the subcollector layer with a Si collector layer on top of the subcollector layer on the substrate or in the window surrounded by the field oxide. A SiGe layer is deposited non-selectively over the field oxide layer and on the collector layer in the window defining the active region. Then a dielectric layer is deposited over the SiGe layer. Finally, there are metalized contacts extending through windows in the dielectric layer above the SiGe layer and the field oxide layer making contact with the SiGe layer through one window and the subcollector layer through another window. For a transistor of the same type, the initial steps are the same and a second Si layer is deposited non-selectively over the SiGe layer before the dielectric layer is deposited with that layer now being deposited over the second Si layer. And, finally, the transistor is completed in the same way with metalized contacts extending through windows in the dielectric layer, an emitter contact above the active region making contact with the uppermost Si layer through one window, a base contact making contact with SiGe layer above the field oxide layer through a second window, and a collector contact through the field oxide layer making contact to the subcollector layer through a third window outside of the active region.