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Polycrystalline CVD diamond substrate for single crystal epitaxial growth of semiconductors

机译:用于半导体单晶外延生长的多晶CVD金刚石衬底

摘要

The present invention is directed towards the production of a single crystal semiconductor device mounted in intimate contact with a polycrystalline CVD diamond substrate which allows the high heat conductivity of diamond to keep the device cool. This device is made by a method comprising the steps of placing in a reaction chamber, a single crystal of silicon heated to an elevated CVD diamond-forming temperature. A hydrocarbon/hydrogen gaseous mixture is provided within the chamber and is at least partially decomposed to form a polycrystalline CVD diamond layer on said silicon. During this deposition/growth phase, an intermediate layer of single crystal SiC has been found to form between the single crystal of silicon and the polycrystalline CVD diamond layer. In the next step of the process, the silicon is etched or removed to reveal the single crystal SiC supported by the polycrystalline CVD diamond layer. Finally, a semiconductor layer (e.g. silicon, SiC, GaAs, or the like) is grown on the exposed single crystal of SiC to produce a single crystal semiconductor polycrystalline CVD diamond mounted device.
机译:本发明涉及单晶半导体器件的生产,该单晶半导体器件安装成与多晶CVD金刚石衬底紧密接触,这允许金刚石的高导热率使器件保持冷却。该装置通过包括以下步骤的方法制成:将单晶硅置于反应室中,该单晶硅被加热至升高的CVD金刚石形成温度。在腔室内提供烃/氢气体混合物,并至少部分分解以在所述硅上形成多晶CVD金刚石层。在该沉积/生长阶段期间,已经发现单晶SiC的中间层形成在硅的单晶与多晶CVD金刚石层之间。在该过程的下一步骤中,蚀刻或去除硅以露出由多晶CVD金刚石层支撑的单晶SiC。最后,在暴露的SiC单晶上生长半导体层(例如,硅,SiC,GaAs等),以生产单晶半导体多晶CVD金刚石安装的器件。

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