Etchant contg. sodium used to prepare plastics - for nucleation and plating by electroless technique, esp. preparing polyimide for copper plating

摘要

An etchant contg. Na is used for prepg. plastics surfaces for nucleation and electroless metal plating. USE/ADVANTAGE - The technique is esp. useful for prepg. polyether-imides and esp. polyimides to etch or swell the surface, so that a strong bond is obtd. on nucleating with PdCl2, before electroless Cu plating. A strong bond is obtd. and any metal structures, e.g. Cu wiring tracks, already present are not damaged. In an example, a polyeter-imide substrate was degreased, then immersed for 1/2-2 min. in a bath of naphthalene-Na at room temp. After drying, it was nucleated with PdCl2 and plated chemically with Cu, which adhered very firmly.