首页> 外国专利> Coating substrate with metal (alloy) - by magnetic sputtering, with substrate mounted on surface held at negative voltage

Coating substrate with metal (alloy) - by magnetic sputtering, with substrate mounted on surface held at negative voltage

机译:用金属(合金)涂覆基板-通过磁溅射,将基板安装在保持负电压的表面上

摘要

Substrate is coated with a metal or metal alloy by magnetic sputtering, the substrate being mounted on a surface held at a negative voltage and moved repeatedly before a target of the magnetron. By using of mounting surfaces larger in area than the target surfaces, the substrate is exposed to an additional ion current, produced by a glow cathode outside the magnetron magnetic field emitting electrons which are removed by an anode positioned in front of the target edge. A W cathode is used as glow electrode and is held at 2200-3000 deg.C. Voltage of more than 0V-60V is maintained between glow cathode and anode. Additional ion current density is 0.05-5 mA/cm2. ADVANTAGE - Reproducibility of coating characteristics is improved.
机译:通过磁溅射用金属或金属合金涂覆衬底,将衬底安装在保持为负电压的表面上并在磁控管的靶之前重复移动。通过使用面积大于目标表面的安装表面,基板暴露于由磁控管磁场外部的辉光阴极产生的附加离子电流,该辉光阴极发射电子,该电子被位于目标边缘前面的阳极除去。 W阴极用作辉光电极,并保持在2200-3000℃。在辉光阴极和阳极之间保持大于0V-60V的电压。额外的离子电流密度为0.05-5 mA / cm2。优点-涂层特性的可重复性得到改善。

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