Thick film / duennschicht - composite substrate and this substrate be used in the electronic circuit device

摘要

a thick film and thin-film verbundsubstrat, on the integrated schaltungschips (1, 1 ') to be mounted, includes a du00fcnnschichtsubstrat (18), which is a signalverdrahtungsschicht (6) and contains a dickschichtsubstrat (17), with the du00fcnnschichtsubstrat layered stratified.with at least a part of a signalverdrahtungsschicht trained signalverdrahtung in dickschichtsubstrat is included.