Method of producing a printed circuit plate or board consists of using a photoresist layer (12) to produce a pattern mask. A first metallic pattern (13) can then be plated onto the exposed substrate. A second photoresist layer (14) can then be applied and in similar fashion used to create a second metallic plating (14) either on top of the existing metal plating (13) or directly onto the second photoresist layer which has been subjected to a plating catalyst treatment or electroless coated with a thin metal film. The first and second resist layer are finally removed to leave a metallic pattern/screen (13,15). ADVANTAGE - The metal pattern is intimately joined to the substrate.a
展开▼
