Adhesive composition for printed wiring boards with acrylonitrile- butadiene rubber having carboxyl groups and 20 PPM or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent

摘要

An adhesive composition for producing printed wiring boards comprising (A) acrylonitrile-butadiene rubber having carboxyl groups in the molecule and containing 20 ppm or less of metal ionic impurities, (B) an alkyl phenol resin, (C) an epoxy resin, (D) a catalyst for electroless plating, and (E) a coupling agent having an ethylene or vinyl group, is useful in a so-called additive process.