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PLATING METHOD OF NI, NI-ZN ALLOY OR NI-ZN-CO ALLOY

机译:NI,NI-ZN合金或NI-ZN-CO合金的镀覆方法

摘要

PURPOSE:To control the concn. of the plating solution for a long time and to enable stable plating by removing the increment of the hydrogen ion concn. from the plating bath by use of a diffusion dialysis tank. CONSTITUTION:In the process of plating, the hydrogen ion concn. in the plating tank B increases. When the initial concn. of sulfuric acid in the cathode room (b) of the electrolysis tank A is set low, the hydrogen ion concn. in the dialysis tank C differs between two rooms separated by an anion-exchange membrane. This causes diffusion of sulfuric acid to the room of lower concn. as shown by an arrow D in the figure. Thereby, the desulferized soln. returns to the plating tank B as shown by an arrow E, while the soln. into which sulfuric acid diffuses returns to the cathode room (b) of the electrolysis tank A as shown by an arrow F. Since the anion-exchange membrane 4 is used in the dialysis tank C in this process, Ni, Zn or Co ions hardly move to the room of lower concn.
机译:用途:控制浓度。镀液的长期使用,并通过去除氢离子浓度的增加来实现稳定的镀覆。通过使用扩散渗析槽从镀浴中去除。组成:在电镀过程中,氢离子浓度较高。电镀槽B内的压力增加。当初始concn。将电解槽A的阴极室(b)中的硫酸的氢离子浓度降低,氢离子浓度降低。透析槽C中的两个腔室之间由阴离子交换膜隔开的两个腔室不同。这导致硫酸扩散到较低浓度的房间。如图中箭头D所示。由此,脱硫的溶液。返回箭头E所示的电镀槽B,而溶液。如箭头F所示,硫酸扩散到其中的溶液返回到电解槽A的阴极室(b)。由于在该过程中在透析槽C中使用了阴离子交换膜4,因此几乎没有Ni,Zn或Co离子移到下层房间。

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