METHOD AND APPARATUS FOR MEASURING POLISHING CAPACITY OF CHEMICAL POLISHING SOLUTION AND METHOD AND APPARATUS FOR CONTROLLING CHEMICAL POLISHING SOLUTION

摘要

PURPOSE:To simply detect the polishing capacity of a chemical polishing solution with high accuracy by bringing a first electrode part composed of a hardly soluble substance whose dissolving speed in the chemical polishing solution is marked low as compared with a material to be treated into contact with the chemical polishing solution to impart a minute current to said electrode part. CONSTITUTION:A first electrode part 12 composed of a hardly soluble substance whose dissolving speed in a chemical polishing solution 20 whose chemical polishing capacity must be measured is markedly low as compared with a material to be treated is brought into contact with the chemical polishing solution 20 to impact a minute current to the first electrode part. At this time, since the first electrode part 12 is composed of the hardly soluble substance whose dissolving speed in the chemical polishing solution 20 is markedly low as compared with the material to be treated, the accurate quantity of the state corresponding to the polishing capacity of the chemical polishing solution 20 is generated in the first electrode part 12. Subsequently, by calculating the quantity of chemical polishing force showing the chemical polishing capacity of the chemical polishing solution 20 from the obtained quantity of state by a chemical polishing force quantity calculating means 18, the polishing capacity of the chemical polishing solution 20 can be simply detected with high accuracy.