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REACTIVE HOT-MELT ADHESIVE CONTAINING A RESIN COMPONENT AND ATHERMALLY ACTIVATABLE, LATENT CURING AGENT, A PROCESS FOR PRODUCING SAID ADHESIVE AND USES THEREOF
REACTIVE HOT-MELT ADHESIVE CONTAINING A RESIN COMPONENT AND ATHERMALLY ACTIVATABLE, LATENT CURING AGENT, A PROCESS FOR PRODUCING SAID ADHESIVE AND USES THEREOF
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机译:包含树脂成分且可热活化的潜伏固化剂的反应性热熔胶及其制备方法,及其使用
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摘要
A reactive hot-melt adhesive is described, which contains a resin component, at least one thermally activatable latent curing agent for the resin component and optionally accelerators, fillers, thixotropic agents and further conventional additives. The adhesive is characterized in that the resin component is obtainable by reacting a) an epoxy resin solid at room temperature and b) an epoxy resin liquid at room temperature with c) a linear polyoxypropylene having amino terminal groups, in which the epoxy resins a) and b) are used in such a quantity, based on the polyoxypropylene with amino terminal groups, that an excess of epoxy groups, based on the amino groups, is ensured.
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