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Power semiconductor package with semiconductor support - has metal core with insulated conductor track structures for semiconductor coupling

机译:具有半导体支撑的功率半导体封装-具有带绝缘导体走线结构的金属芯,用于半导体耦合

摘要

The package contains an integrated power semiconductor on a support, connectable via conductors, such as bond wires, to adjacent, surrounding contact points. The support is formed by a metal core (23) with insulated conductive track structures, with the power semi-conductor (22) directly secured to it. The semiconductor has an electric coupling to the conductive track structures (24,25,27,28) of the metal core. Pref. the semiconductor is directly glued to the metal core. The semiconductor may be coupled to the conductor track structures (24,27) by bond wires (26), with the structures leading to external, bondable contacts. USE/ADVANTAGE - For hybrid circuits. Suitable for high temp. regions.
机译:该封装在支架上包含集成的功率半导体,该功率半导体可通过导体(例如键合线)连接到相邻的周围接触点。支撑件由具有绝缘导电迹线结构的金属芯(23)形成,功率半导体(22)直接固定在其上。半导体具有与金属芯的导电迹线结构(24、25、27、28)的电耦合。首选半导体直接粘在金属芯上。半导体可以通过键合线(26)耦合到导体迹线结构(24,27),该结构通向外部的可键合触点。使用/优点-用于混合电路。适用于高温。地区。

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