Support matrix for integrated semiconductors, has frame, conductor track structures, and flowable silicon structures

摘要

A support matrix comprises a frame; conductor track structures running on the frame, and having bonding lead(s) for connecting the conductor track structures to an integrated semiconductor; and flowable silicon structures disposed in a region of the bonding lead(s) and serving to space apart the support matrix and the integrated semiconductor. A support matrix comprises a frame; conductor track structures running on the frame, and having bonding lead(s) for connecting the conductor track structures to an integrated semiconductor; and flowable silicon structures disposed in a region of the bonding lead(s) and serving to space apart the support matrix and the integrated semiconductor. The bonding lead has a bonding region, and groove(s) formed between the bonding region and the conductor track structures. The groove (7, 8) functions as a barrier for preventing a flow of the flowable silicon structures onto the bonding region. An Independent claim is also included for a method of producing the support matrix, comprising forming groove(s) between the bonding region of the bonding lead and the conductor track structures; and forming the flowable silicon structures on the frame (12) serving to space apart the support matrix and the semiconductor.