Brief description of embodiments of a low electrical resistance between a metal and an htc superconductor ceramic.

• 1. 一种表贴型陶瓷金属外壳的低电阻高载流引线结构 [P] . 中国专利： CN111952252A . 2020-11-17
• 2. 用于在电子元件的金属球和电路的接纳垫之间产生焊接接头的方法和用于实施此方法的焊接炉 [P] . 中国专利： CN1480015A . 2004-03-03
• 3. METHOD FOR PRODUCING A LOW ELECTRIC RESISTANCE LINK BETWEEN A METAL AND A HTC SUPERCONDUCTIVE CERAMIC. [P] . 法国专利： FR2654261A1 . 1991-05-10

  机译： 在金属和HTC超导陶瓷之间产生低电阻链路的方法。

• 4. Brief description of embodiments of an electrical contact for superconducting ceramic. [P] . 法国专利： FR2677353B1 . 1993-08-20

  机译： 用于超导陶瓷的电触点的实施例的简要描述。

• 5. Brief description of embodiments of a connection has high performance between a metal and a solid piece in a superconducting ceramic. [P] . 法国专利： FR2664890B1 . 1992-09-18

  机译： 连接的实施例的简要描述在超导陶瓷中的金属和固体件之间具有高性能。

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• 6. Fabrication of Metal Matrix Composites Based on Stainless Steel Having Low Electrical Contact Resistance by Powder Metallurgy [O] . Joon-hwan Choi, Jong-jin Choi, Jungho Ryu, 2016

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